- Opportunity ID:
- MYO-201724288
- Type :
- Full time
- Position Level :
- Senior Executive
- Industry :
- Engineering - Semiconductor
- Job Specialization :
- Engineering - Other Engineering
- City :
- Seremban
- Description :
- To lead the Die bond engineering team
Leading breakthrough projects to support improvement in both Reel to Reel and STS
To support yield losses improvement activities
To support BOM material savings activities
To support DFPC discussion with business line - Requirements :
- Master's/ Bachelor's Degree in Engineering/Applied sciences/ Physics
5-10 years working experience in semiconductor/manufacturing industries, die bond process
Preferred with SSGB certification
Experience in BOM material management
Experience with Die Free Package Cost (DFPC) will be an added advantage - Lowest Qualification :
- Bachelor Degree
- Closing Date :
- 11/29/17, 12:00 AM
Nexperia Malaysia Sdn Bhd
- Phone :
- 06-6766282
- Address :
- PT 12687 Tuanku Jaafar Industrial Park, 71450 Seremban,Negeri Sembilan, Malaysia
- City :
- Seremban
- State :
- Negeri Sembilan
- Country :
Description
Nexperia Semiconductors is an industry leading supplier of Discrete, Logic and PowerMOS Semiconductors focused on the Automotive, Industrial, Computing, Consumer, and Wearable Application. Nexperia products enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, we are driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets.
Nexperia is a global semiconductors manufacturer headquartered in Nijmegen, The Netherland.
Benefit
Attractive remuneration package awaiting suitable candidates, it really does make sense to become a part of our family
