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Opportunity ID:: MYO-201513441
Type :: Full time
Position Level :: ---
Industry :: Engineering - Electronics
Job Specialization :: Designing - Electronic/ Electrical Hardware
City :: Kempas
Description :: - Work internal Engineering team and other external Customer Engineering teams in developing and validating efficient manufacturing processes for Optoelectronics devices like Photo detectors, laser diodes, Photo Voltaic cell assembly etc;
- To develop Micro Electronics assembly process such as die attach, wire bonding molding, welding and other encapsulation process etc;
- To lead process improvement projects along with cross functional teams from Manufacturing, QA, Engineering etc;
- To lead investigating Customer complaints and to conduct failure analysis for root cause identification
Requirements :: - Master's / Degree in Electronics / Mechanical / Electrical, Microelectronics/Optoelectronics or equivalent.
- Minimum 5 years experience in Microelectronics / Optoelectronics devices packaging & Assembly of Photo detectors, Light emitting diodes, Photovoltaic cells, Hybrid Microcircuits etc;
- Hands on experience in the assembly process such as Die attach, - Wire bond, Encapsulation / Transfer molding process etc; related to COB, ICs, Hybrid circuit etc;
- Strong Analytical and Engineering skills to improve manufacturing process efficiency & yields
- Excellent data analysis skills and conversant with SPC tools like process capability studies, process optimization, FMEA etc;
- Computer literate with good command of spoken and written English and Bahasa Malaysia
Lowest Qualification :: Bachelor Degree
Closing Date :: 9/12/15, 12:00 AM

GPM Technology Sdn Bhd (HQ)

City :: Ulu Tiram
State :: Johor
Country :

Description

Metal Stamping IndustryWe are one of the preferred suppliers of metal stamping components and sub-assembly for the electronic, computer, industrial and consumer products, including office automation equipment throughout Asia, Europe and United States of America.