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Opportunity ID:
MYO-20131908 
Type :
Full time 
Position Level :
--- 
Industry :
Engineering - Electrical/ Power 
Job Specialization :
Engineering - Electronics 
City :
Johor 
Description :
MYR 700 - 800

3 Internship position(s) for duration of 3 month(s). 
Requirements :
- Candidate must possess or currently pursuing a Bachelor's Degree in Engineering (Electrical/Electronic) or equivalent.
- Required skill(s): HT & LV knowledge, Building M&E services.
- Preferred skill(s): Autocad.
- Required language(s): Chinese, English 
Lowest Qualification :
Bachelor Degree 
Closing Date :
6/20/13, 12:00 AM 

BOND M&E Sdn Bhd


Phone :
07-3544166
Address :
17, Jalan Angkasa Mas 5,Kaw. Perindustrian Tebrau II,
City :
Johor Bahru,
State :
Johor
Country :

Description

BOND GROUP is a specialised Mechanical & Engineering solutions provider in Malaysia and Singapore. We have worked on numerous projects of varying sizes in the region and our growing client list is a testament of our work ethics and commitment to see that every project is a success.

Our immediate focus now is to bring BOND GROUP to a higher level and expand our operations to the regional level. With our management team's drive and our capable workforce, we are ready to face the challenges ahead and forge new chapters of our growth.

"BOND GROUP is your Total M&E Solutions Provider"

Visit us at http://www.bmesb.com.my/